How is a year-old startup competing with giants in localising power semiconductor development? Vijay Bolloju from iVP Semiconductor speaks to EFY’s Yashasvini Razdan, unveiling its patented high-current tech and roadmap to India’s semiconductor future.
Q. Could you tell us about iVP Semiconductor?
A. iVP Semiconductor is a fabless power semiconductor company. We focus on power device manufacturing by either creating or licensing intellectual property (IP) for power devices such as application-specific MOSFETs (metal-oxide-semiconductor field-effect transistors), IGBTs (insulated-gate bipolar transistors), and silicon carbide components. Currently, general-purpose MOSFETs are available, but they may not be optimised for specific frequencies or voltages. We use our partner foundries to manufacture them. The designs are tailored to suit application needs, optimising cost and performance. We plan on making truly Indian power semiconductor products.
Q. What problem statement do you intend to solve with the IP you are creating?
A. About 80 per cent of the design in power electronics is actually mechanical or thermal, rather than MOSFETs or IGBTs as is conventionally known. High-current products built on PCBs or metal core PCBs experience high current density in the traces, leading to early failures. Many products in the market today are less than two years old, and as ambient temperatures rise, these failures are expected to increase due to the large current density in thin copper traces.
By reducing MOSFET or IGBT usage by nearly one-third in market designs, we tackle failures with innovative solutions and optimised thermal stack performance. Our focus is on reducing the amount of silicon or silicon carbide needed for a given function, lowering costs, and improving reliability. This is achieved by applying our patented technology to reduce current density in copper terminals.
Q. Who are you targeting with this solution?
A. We have two market approaches. One is through discrete components as a component business, and the other is through high-current and high-power integrated power modules.
For discrete components, our target customers include any company involved in electronics manufacturing, using packages such as TO-220s and TOLLs. This is an opportunistic market, and we will penetrate it wherever possible.
On the other hand, the more strategic focus is on integrated power modules. A major portion of electric vehicle (EV) components today are imported, so we are working on locally designed and manufactured integrated power modules with superior performance at competitive pricing. Our long-term agenda also includes renewable energy, energy storage, solar pumps, and air conditioners, where electronics localisation is essential.
Q. What industry trends motivated this two-pronged approach?
A. This approach aligns with the increasing demand for high-current applications in EVs and renewable energy. India currently lacks the necessary toolsets to manufacture such high-current products, and using printed circuit boards (PCBs) or metal core PCBs is not a reliable solution. To address this, we are developing patented thermal stacks that enhance power semiconductor efficiency, reducing size, and weight, and improving reliability. I can say this is our current focus.
Q. What kind of high-current applications in EVs can make use of this solution? Any examples?
A. A critical aspect of EV performance is the cyclic load. In cities like Bengaluru or Chennai, where frequent stop-and-go traffic is common, temperature fluctuations occur at the chip level. The expansion and contraction of different materials in the thermal stack—such as silicon chips, solder, and copper—cause fatigue and early failures.
We have studied this phenomenon and found that reducing temperature ripples can significantly extend product life. This is achieved by using a large amount of metal under the chips, which is not feasible with PCBs or metal core PCBs. Our patented solution enables this while also making manufacturing viable in India without relying on imported ceramic substrates.
Q. What is your business strategy to compete with already established global giants in power semiconductors?
A. In the discrete market, we work with global companies that want to enter the Indian market but lack a direct approach. We will create a customer base for them and, over the next three years, develop our own IP for these products. Our plan is to follow the foundry model, where designs are developed locally and fabricated in partner foundries.
For integrated modules, our patented approach allows us to localise almost every component except silicon. We are creating a supply chain around Bengaluru and Tamil Nadu, ensuring hyperlocalisation. This not only provides cost advantages but also benefits ancillary industries that currently lack visibility in the semiconductor market. We are working closely with them, developing components such as thermal interface materials and moulding compounds.
Q. What challenges does your engineering team face in keeping up with rapid technological advancements?
A. The design environment in India is not as mature as international markets. Engineers tend to work in silos—electrical engineers focus only on electrical aspects, and mechanical engineers on mechanical aspects. We are trying to change this approach because cross-functional knowledge is essential for optimised design.
For instance, if an electrical engineer needs ten MOSFETs for a design, they may place them in a large enclosure without considering thermal optimisation. However, by involving thermal engineers early, the number of MOSFETs required may be reduced to four while improving efficiency. We ensure all teams collaborate from the start.
Q. Does this approach not make the design and development process longer and more tedious?
A. Yes, it does—at least for the first product. However, we work with our manufacturing partners from the prototype stage, so we understand their constraints early on. This prevents delays caused by design incompatibility with manufacturing processes.
By involving manufacturing teams from the beginning, we avoid scenarios where a design is completed and then found to be infeasible due to machine limitations or cost constraints. While the first product takes longer, subsequent products will roll out more efficiently as both our team and manufacturing partners gain experience.
Q. What kind of partners do you work with, and are you looking for new partners?
A. A power semiconductor module consists of many components. Many local companies manufacture key components such as shunt resistors, thermal sensors, copper bus bars, and lead frames. We are working with startups and research organisations to develop high-performance thermal components.
We have a manufacturing partner specialising in new product development. Since some of our required materials are not yet available in India, we collaborate with local suppliers to help them develop these materials. Over the next two to three years, we hope to establish our own silicon and silicon carbide devices along with a strong supply chain within a 100km radius—achieving true hyperlocalisation.
Q. Where will this ecosystem be located? Karnataka or Tamil Nadu?
A. We want it to be as hyperlocal as possible, but we are not limiting ourselves to a specific location. If an existing company wants to improve its product and meets our requirements, we are happy to work with them.
Q. Are you currently hiring, and what skills do you look for in your engineering team?
A. Yes, we are hiring, as we are a new company. Our approach is to build a strong core team of experts in electrical design, embedded design, software developers, packaging design, quality, and reliability. We aim for organic growth, allowing junior employees to progress within the company. We recruit skilled individuals as opportunities arise rather than waiting for specific vacancies.
Q. What skills should aspiring engineers develop to join your team?
A. As a product company, circuit design for power electronics is fundamental. However, we prioritise free thinkers—engineers who challenge conventional approaches and validate new ideas. While technical knowledge is widely available, creativity and problem-solving skills are crucial. We also require traditional skill sets, such as electrical design, packaging design, and testing. Field application engineers play a key role in ensuring product fit for customers and providing valuable feedback for future development.
Q. What steps is iVP Semiconductor taking to create a sustainable growth model?
A. iVP Semiconductor is one of the first companies of its kind in India, and we aim to set a benchmark for others to follow. The market is large, and it is not about competition—it is about collaboration. If other companies pursue similar initiatives, we can collectively enhance India’s semiconductor ecosystem. By growing alongside our partners, we are creating a sustainable model for future semiconductor innovation in India.
