Editor's Choice
The Inspection Gap In India’s Semiconductor Ambitions
KoCos is expanding semiconductor inspection beyond conventional dimensional measurement, including patented wafer-notch inspection and planned crystal-defect inspection.
As semiconductor structures become more complex, inspection must...
Policy Corner
Samsung’s India Policy Chief Rajiv Aggarwal Resigns
Former bureaucrat steps down after four years amid rising regulatory friction over smartphone pre-installations and e-waste policies.
Samsung India’s head of public policy and environmental...
My Story
From Rural Gujarat To Building Security Solutions For Global Customers!
The journey of Ganesh Jivani, who transformed improbable ambitions into reality, is inspiring. Through self-directed learning and perseverance, he discovered his strengths and built...
From Survival To CEO: The Story Of Taher Madraswala
The life of Taher Madraswala is a story of an indomitable spirit—a man who survived hunger and adversity to support his family while building...
“Miles To Go Before I Sleep”– Prof. (Dr) Rajat Moona, Director, IIT Gandhinagar
A teacher illuminates the path to success through the light of knowledge, yet some teachers extend that light to society through their contributions and...
“Becoming Clear” – Rajeev Madhavan, Founder and General Partner, Clear Ventures
From a nonchalant teenager to authoring a book on Verilog at 25 and launching successful IPOs for startups on the US stock market, Rajeev...
‘Beating The Odds To Build Indian Telecom Products’ – Sanjay Nayak Co-Founder, Tejas Networks
From a boarding school in Raipur to doing pioneering work on the world’s first Verilog simulator, laying the groundwork for electronics product development in...
Electrical Vehicle Sector
Component Cost Inflation to Eradicate Over 230m Budget Smartphones by 2030
Rising component prices and elevated baseline specifications threaten to shrink global sub-$200 handset shipments by 40 per cent.
More than 230 million annual sub-$200 smartphone...
Manufacturing
ERS Launches 310×310mm Packaging System For AI And Chiplet Chips
ERS electronic has delivered its first automated 310×310 mm panel-level packaging system to a semiconductor manufacturer, integrating bonding, debonding and detaping to support higher-throughput...
Trade Channel
India-Mercosur Pact Cuts Paperwork For Electronics Trade
India and Mercosur will accept electronic Certificates of Origin, potentially reducing documentation costs and processing time for electronics exporters and importers claiming preferential tariffs.
India...
Trends & Reports
Component Cost Inflation to Eradicate Over 230m Budget Smartphones by 2030
Rising component prices and elevated baseline specifications threaten to shrink global sub-$200 handset shipments by 40 per cent.
More than 230 million annual sub-$200 smartphone...
Latest News
Component Cost Inflation to Eradicate Over 230m Budget Smartphones by 2030
Rising component prices and elevated baseline specifications threaten to shrink global sub-$200 handset shipments by 40 per cent.
More than 230 million annual sub-$200 smartphone...
Latest Articles
Industry's Buzz
Component Cost Inflation to Eradicate Over 230m Budget Smartphones by 2030
Rising component prices and elevated baseline specifications threaten to shrink global sub-$200 handset shipments by 40 per cent.
More than 230 million annual sub-$200 smartphone...
Energy In Motion Opens Heavy-Duty Battery Swapping Station in Rewari
The new Haryana facility along NH-48 corridor enables seven-minute battery swaps for electric freight vehicles.
Energy In Motion Ltd (EIM) has inaugurated a heavy-duty battery...
Delta Electronics, NVIDIA Join Forces On Level 4 Autonomous Driving
Delta Electronics is combining its power electronics, EV powertrain and in-vehicle computing capabilities with NVIDIA Hyperion to develop Level 4 autonomous-driving systems and expand...
ERS Launches 310×310mm Packaging System For AI And Chiplet Chips
ERS electronic has delivered its first automated 310×310 mm panel-level packaging system to a semiconductor manufacturer, integrating bonding, debonding and detaping to support higher-throughput...
Netlist Seeks US Import Ban on Micron Memory Chips Used by Nvidia and Google
Patent-licensing firm files ITC complaint alleging high-bandwidth memory infringement across major AI server hardware.
Computer memory firm Netlist has filed a complaint with the US...
Lam Research Opens 470000-Sq-Ft Logistics Hub to Bolster US Chip Supply Chain
Centralised California facility leverages robotic automation to support global AI chip equipment demand and accelerate logistics.
Semiconductor equipment manufacturer Lam Research has opened a 470,000-square-foot...
MIPS and Xcelsa Labs Partner to Accelerate Custom Silicon Development
Strategic collaboration integrates verified intelligence platforms to cut design iteration cycles for AI, automotive, and robotics hardware.
MIPS, a subsidiary of GlobalFoundries, has announced a...
Global Electronics Association and Fraunhofer Partner on EU Chips Act Pilot Line
Strategic collaboration aims to standardise advanced packaging and chiplet integration to bridge the gap between pilot-line innovation and mass production.
The Global Electronics Association has...
Pulsiv Signs Manufacturing Deal for High-Power USB-C Modules
Pulsiv has developed its modules using its patented OSMIUM AC-DC conversion technology
UK-based power electronics company Pulsiv has signed an exclusive manufacturing and supply agreement...
TOPPAN Opens First Overseas FC-BGA Substrate Plant in Singapore
FC-BGA substrates are used in high-density semiconductor packages
TOPPAN Inc. has established its first overseas production facility for Flip Chip Ball Grid Array (FC-BGA) substrates...
Learn From Leaders
Does India’s Chip Packaging Growth Need Local Materials At Scale?
What will it take for specialised semiconductor materials manufacturing to grow in India? Packaging volumes will be a key factor as OSAT facilities move...
“Our goal is to build data centres in space.” – Ronak Kumar Samantray, TM2Space
A space startup aims to build orbital data centres, letting users run AI models and store data on satellites while also supplying satellite hardware...
India’s Photonics Puzzle Is Finally Coming Together
Can India turn its scattered photonics capabilities into a stronger industry? A new association aims to connect the ecosystem and strengthen the domestic value...
Mini-Circuits CEO Jin Bains on Navigating High-Frequency Component SWaP-C Constraints, Emerging Markets, and Career...
In this exclusive, Jin Bains, Chief Executive Officer (CEO) of Mini-Circuits, explains in a conversation with Dilin Anand of EFY about areas of emerging...
India Needs Not a Hundred, But Thousands of Chip Diversified Companies
Can India build a semiconductor ecosystem beyond fabs? Indiesemic believes thousands of diversified chip companies are needed to make that possible.
India’s semiconductor push is...
“We Aim To Make Quantum Computing More Visible, Understandable, And Open To Build On”...
From building India’s first open quantum hardware ecosystem to assembling a working quantum computer in just four months, Qbit Force is redefining how deep...
“A Made-In-India Robotic PCB Soldering System That Automates The Through-Hole Soldering Process!” – Shrikrushna...
Electronics manufacturing is complex, and automation often comes at a high cost. To bridge this gap and offer a more affordable solution in India,...
“Enterprise Computing Is Shifting From CPU to GPU And Now Toward NPU-Based Systems ”...
The shift from CPU to GPU to NPU-based computing is redefining today’s enterprise endpoints. In an exclusive conversation, Navdeep Narula from Ingram Micro discusses...
India’s Robotics Push Opens New Hardware Opportunities
How do you build India’s physical AI future when critical robot components still come from overseas? Niqo Robotics reveals where the gaps remain.
India’s push...
How A Material Thinner Than Human Hair Could Transform EV Batteries And Electronics –...
What if a material 200,000 times thinner than a human hair could transform EV batteries, semiconductors, and advanced electronics? NoPo Nanotechnologies is making that...
Startups
“The cloud isn’t the only way to run AI. We’re proving it can happen...
A startup is building a decentralised AI and communication network that runs across everyday devices instead of centralised cloud servers. In an interview, Jash...
Building AI Chips, One Block at a Time
What if building an AI chip became as simple as assembling reusable blocks? The startup is working to make custom silicon accessible beyond the...
“We Let Designers Focus on Innovation, Not Infrastructure.”- Seema Johar, Compcarta Solutions
In an exclusive interview, Seema Johar of Compcarta speaks with EFY’s Akanksha Sondhi Gaur about why setting up an EDA environment can be harder...
Space Solar Secures $1.7m ARIA Contract for Wireless Power Beaming
Harwell-based firm to develop ground-to-air RF beaming technology for persistent high-altitude platforms.
Harwell-based wireless power specialist Space Solar has secured a $1.7 million (£1.3 million)...
“We are democratising custom silicon with reusable chiplets, enabling more companies to build their...
In an exclusive interview,Mohit Gupta from TYLsemi explains to Saba Aafreen from Electronics For You as to why the future of AI infrastructure will...
“Running A Semiconductor Manufacturing Facility Requires A High Level Of Discipline, Consistency, And Attention”-...
Prime Minister Narendra Modi recently laid the foundation stone for ASIP Technologies’ semiconductor facility in Tarluvada, Visakhapatnam. In an interaction with EFY’s Nitisha Dubey,...
A Startup Building An AI Copilot For Physics
What if engineers could solve complex design problems in minutes instead of hours? An AI startup is building a system that uses physics-based AI...
“Our goal is to build data centres in space.” – Ronak Kumar Samantray, TM2Space
A space startup aims to build orbital data centres, letting users run AI models and store data on satellites while also supplying satellite hardware...
“We Want to Build Globally Competitive Deep-Tech Products from India” – Manivannan Subramaniam, CIYES...
Can India build globally competitive deep-tech products? Manivannan Subramaniam of CIYES Systems believes it can. In this interview with EFY's Nitisha Dubey, he discusses...
Raptee.HV, Rajalakshmi Engineering College Launch EV Centre of Excellence
The facility is among the first initiatives under Raptee.HV Academy
Raptee.HV has launched a Centre of Excellence for Electric Mobility at Rajalakshmi Engineering College (REC),...
Key Sectors
Component Cost Inflation to Eradicate Over 230m Budget Smartphones by 2030
Rising component prices and elevated baseline specifications threaten to shrink global sub-$200 handset shipments by 40 per cent.
More than 230 million annual sub-$200 smartphone...
The Inspection Gap In India’s Semiconductor Ambitions
KoCos is expanding semiconductor inspection beyond conventional dimensional measurement, including patented wafer-notch inspection and planned crystal-defect inspection.
As semiconductor structures become more complex, inspection must...
Energy In Motion Opens Heavy-Duty Battery Swapping Station in Rewari
The new Haryana facility along NH-48 corridor enables seven-minute battery swaps for electric freight vehicles.
Energy In Motion Ltd (EIM) has inaugurated a heavy-duty battery...
Delta Electronics, NVIDIA Join Forces On Level 4 Autonomous Driving
Delta Electronics is combining its power electronics, EV powertrain and in-vehicle computing capabilities with NVIDIA Hyperion to develop Level 4 autonomous-driving systems and expand...
ERS Launches 310×310mm Packaging System For AI And Chiplet Chips
ERS electronic has delivered its first automated 310×310 mm panel-level packaging system to a semiconductor manufacturer, integrating bonding, debonding and detaping to support higher-throughput...