Amkor Technology has partnered with AMD on advanced chip packaging as it expands its capabilities to meet rising demand from AI and data center markets.
Amkor Technology has announced a collaboration with AMD to provide advanced chip packaging services, highlighting the company’s growing role in the high-performance semiconductor market.
The partnership comes as Amkor expands its operations in Arizona. The company recently acquired an additional 67 acres of land next to its planned semiconductor packaging campus, bringing the total site size to 171 acres. Manufacturing at the facility is expected to begin in 2028.
Advanced packaging has become a critical part of chip production as modern processors increasingly combine multiple chip components into a single package. Demand for such technologies is rising rapidly, driven by AI, cloud computing, and data center applications.
Historically focused on traditional packaging services, Amkor is now moving into more advanced technologies. The company is also working with TSMC in Arizona, leveraging selected packaging technologies to support shared customers.
Amkor had previously disclosed plans to support customers such as Nvidia and Apple at its Arizona facility. The latest announcement adds AMD to its growing list of strategic partners.
According to CEO Kevin Engel, the company is becoming more closely integrated with customers and moving further up the semiconductor value chain. This shift is helping Amkor expand beyond conventional packaging services and capture greater value from its expertise.
At its investor event, the company projected revenue of $8.5 billion to $9.5 billion by 2028, with sales expected to reach $11 billion by 2030. However, the midpoint of its 2028 forecast fell slightly below analysts’ expectations, leading to a decline in the company’s shares following the announcement.
