Expanding its US presence, Amkor’s new Arizona campus with a $7 billion push aims to power Apple, NVIDIA and the AI-driven semiconductor era.
Amkor Technology has begun construction of a new semiconductor packaging and testing campus in Peoria, Arizona, US. The $7 billion project will be completed in two phases, with construction scheduled to finish by mid-2027 and production to begin in early 2028.
According to a report by the Manufacturing Dive, the Arizona campus will feature 750,000 square feet of cleanroom space and advanced facilities for high-volume chip packaging and testing, which Amkor says will be the first of its kind in the US. The company has significantly raised its investment from an earlier $2 billion plan announced in 2022.
In this venture, Amkor will work closely with Taiwan Semiconductor Manufacturing Company (TSMC) to support major clients such as Apple and NVIDIA. The new site will complement TSMC’s nearby wafer fabrication plants, helping establish what Apple COO Sabih Khan called an ‘end-to-end silicon supply chain’ in the US.
Apple will be the first and largest customer of the new facility, continuing its long partnership with Amkor. NVIDIA will also source chips from the Arizona site. The investment is expected to create around 3000 jobs and strengthen domestic semiconductor supply chains, which have long relied on imports from Asia.
Furthermore, the project will receive $407 million from the US Chips and Science Act, along with federal, state, and local incentives.
Amkor’s Arizona expansion comes as chipmakers race to meet surging demand for semiconductors powering artificial intelligence, high-performance computing, mobile, and automotive technologies. The company CEO Giel Rutten said Arizona offers the ideal combination of skilled talent, infrastructure, and an established semiconductor ecosystem.
