Chips produced using N3P will likely offer Apple higher energy efficiency and computational performance, which are critical for AI applications.
The Cupertino-based global tech giant Apple is reportedly collaborating with Broadcom to create its first server chip specifically tailored to artificial intelligence processing. This initiative would position the iPhone maker alongside other major technology firms that have developed proprietary chips to handle compute-intensive AI tasks, thereby reducing dependence on Nvidia’s costly and scarce processors.
The report also added that Apple’s AI chip, internally code-named Baltra, is slated for mass production by 2026. The company intends to produce the chip using Taiwan Semiconductor Manufacturing Co.’s (TSMC) advanced N3P process, one of the most cutting-edge manufacturing technologies.
N3P is part of TSMC’s 3-nanometer family, representing a cutting-edge node with improved power efficiency, performance, and transistor density compared to earlier nodes. Chips produced using N3P will likely offer Apple higher energy efficiency and computational performance, which are critical for AI applications. Developing its own AI chip demonstrates Apple’s focus on optimizing hardware and software for seamless integration.
Apple’s track record in developing in-house chips, such as the M-series processors, has been a significant milestone in the company’s vertical integration strategy. These chips, which replaced Intel processors in Mac laptops, are lauded for their remarkable performance, energy efficiency, and seamless integration with macOS and other Apple software.
A year back, Apple signed a multi-billion-dollar deal with a chipmaker for 5G components to enhance its devices’ connectivity performance while optimizing for its specific design and ecosystem needs. These chips would likely be tailored to handle AI workloads efficiently, improving performance and energy efficiency for AI-driven features like Siri, on-device processing, and advanced camera functionalities.
