Through this partnership, both companies will focus on process technologies to address the growing demands of AI
Applied Materials (AMAT) has collaborated with Taiwan Semiconductor Manufacturing Company (TSMC) to create next-generation semiconductor technologies at Applied’s EPIC Centre in Silicon Valley.
As Applied Materials mentioned, both companies will “co-innovate to advance materials engineering, equipment innovation, and process integration technologies designed to deliver energy-efficient performance from the data centre to the edge.”
Through this partnership, both companies will focus on process technologies to address the growing demands of AI and high-performance computing, new materials and next-generation manufacturing equipment, enabling precise formation of increasingly complex 3D transistor and interconnect structures, among others.
“Applied and TSMC share a long history of deep collaboration built on trust and a shared commitment to advancing innovation at the leading edge of semiconductor technology,” said CEO of Applied Materials Gary Dickerson.
California-based Applied’s new, $5 billion EPIC Center represents the largest-ever U.S. investment in advanced semiconductor equipment R&D, as per the company. The center will be operationally ready this year.
