Driving the next leap in edge computing, congatec and Qualcomm join forces with advanced Dragonwing platforms poised to reshape high performance embedded solutions.
congatec has announced a technology collaboration with Qualcomm Technologies to fast track the commercialisation of high performance embedded edge AI systems built for size, weight and power constrained industrial applications. The partnership brings Qualcomm’s Dragonwing processor portfolio together with congatec’s application ready COM HPC Mini modules, enabling developers to build compact yet powerful edge devices with significantly improved energy efficiency.
The first phase of the collaboration integrates Qualcomm’s Dragonwing IQ X Series processors into congatec’s COM HPC Mini ecosystem, giving developers a new ARM based option for high end computing workloads. Designed to be nearly the size of a credit card, the modules target demanding industrial use cases that require high compute density, ultra low power consumption and robust connectivity.
“Our new technology collaboration with Qualcomm Technologies allows developers to achieve the same level of extreme computing performance and interface bandwidth with a power efficient design that was only possible with x86 architectures for decades,” said Konrad Garhammer, CTO and COO at congatec. “For the first time, developers can create high end embedded applications that leverage the outstanding energy efficiency and performance per watt for the most performance intensive embedded hardware.”
Enrico Salvatori, Senior Vice President and President of Qualcomm Europe, said the collaboration “combines best in class compute performance, industry leading power efficiency, on device AI and industrial grade features” of the Dragonwing platform with congatec’s scalable and rugged module ecosystem. He added that the companies aim to drive widespread deployment of next generation industrial PCs and edge AI solutions.
