The Physical AI semiconductor market is projected to reach approximately $123 billion by 2030
DEEPX and Hyundai Motor Group’s Robotics LAB have announced a partnership to develop a next-generation Physical AI computing platform for advanced robotics.
The objective of this partnership is to co-develop an AI computing architecture capable of running large-scale generative AI models in real time within robotic systems. It represents a strategic effort to jointly design the core computing infrastructure for next-generation robot platforms.
The robotics AI field is increasingly centred on Vision-Language-Action (VLA) and Vision-Language Model (VLM) technologies, which enable robots to perceive their surroundings via cameras, understand natural-language commands, and make autonomous decisions. These capabilities are essential to transforming robots from simple automated machines into intelligent systems that can see, understand, and act.
To ensure stable deployment of these capabilities, the two companies will collaborate across four key areas: ultra-low-power AI semiconductor architecture, AI computing hardware systems for robotics, Physical AI software stack, and robotics application AI libraries.
At the core of this collaboration is DEEPX’s next-generation chip, the DX-M2 — a Physical GenAI semiconductor designed to run large-scale AI models in ultra-low-power environments. This enables on-device AI inference in robotics, autonomous mobile systems, and industrial automation.
“The AI industry is rapidly shifting from data center-centric models to a Physical AI era. Ultra-low-power computing capable of running AI in real-world systems will become the core infrastructure. DEEPX aims to become the global leader in Physical AI computing platforms powering AI across robotics and industrial systems,” said Lokwon Kim, CEO, DEEPX.
