The collaboration aims to develop scalable inkjet-driven semiconductor production technologies, bridging laboratory research with high-volume manufacturing.
Seiko Epson Corporation and Manz Taiwan Ltd. have announced a strategic collaboration to accelerate the adoption of inkjet technology in semiconductor manufacturing, marking a significant step toward next-generation chip production processes.
Under the partnership, Epson will integrate its high-precision inkjet printhead technology with Manz Asia’s expertise in semiconductor equipment development and software solutions. The companies aim to create advanced semiconductor manufacturing processes powered by inkjet-based digital additive technologies.
As part of this initiative, an inkjet laboratory equipped with Epson printheads was established in November 2024 at the Manz Asia R&D Center in Taoyuan City. The facility supports semiconductor equipment manufacturers and other industry players by providing consultation on inkjet-enabled process innovations, sample printing, and evaluation services.
Recently, the two companies signed a memorandum of understanding to deepen their collaboration. Beyond research and testing, the partners will now focus on developing equipment capable of supporting production-scale semiconductor manufacturing, paving the way for global deployment of inkjet-based manufacturing technologies.
Epson will contribute its expertise from its inkjet application laboratories to assist customers with process validation and preparation for volume production.
Robert Lin, CEO of Manz Asia, said digital printing is poised to reshape semiconductor manufacturing by enabling precise and scalable processes. By combining Epson’s advanced printhead technology with Manz’s equipment and process capabilities, the collaboration will allow semiconductor companies to validate process parameters across multiple applications and transition smoothly from R&D to mass production.
Shunya Fukuda, chief operating officer of Epson’s IJS Operations Division, noted that digital additive manufacturing using inkjet technology is expected to play a crucial role in the evolution of semiconductor packaging. He added that Epson will leverage its droplet control technology and manufacturing expertise developed in display and printed electronics industries to help build a scalable platform that connects laboratory development with high-volume production.
The partnership reflects a growing push toward more flexible, efficient, and sustainable semiconductor manufacturing processes. Both companies plan to continue supporting innovation in printed electronics and semiconductor production through advanced inkjet technologies.
