Malaysia-based semiconductor packaging startup FusionAP has secured $2 million in a pre-seed funding round led by Vertex Ventures Southeast Asia and India and Southern Capital Group, as the company looks to strengthen its advanced semiconductor packaging capabilities and position itself as a geopolitically neutral OSAT platform.
Founded in 2025, FusionAP focuses on outsourced semiconductor assembly and test (OSAT) technologies, a critical segment of the semiconductor value chain responsible for chip assembly, packaging, and quality testing. The company aims to serve global semiconductor firms seeking diversified supply chains beyond traditional East Asian hubs, particularly Taiwan, which currently dominates the OSAT landscape.
FusionAP is developing advanced packaging solutions for integrated circuit designers and wafer fabrication companies, including 2.5D and 3D packaging technologies designed to support next-generation semiconductor applications. The startup said its platform is built to address rising global demand for resilient and geographically diversified semiconductor manufacturing ecosystems.
The fresh capital will be deployed toward engineering and process integration, research and development, intellectual property creation, and the establishment of pilot manufacturing capacity. Investors believe the company is strategically positioned to benefit from increasing industry interest in Southeast Asia as an alternative semiconductor supply chain destination.
FusionAP is also among the founding members of the Malaysia Advanced Packaging Consortium, an industry initiative established to strengthen the country’s semiconductor packaging ecosystem and accelerate innovation in advanced chip packaging technologies.
In addition to the private funding round, the company has been offered a matching research grant from the Malaysia Science Endowment under the country’s Ministry of Science, Technology, and Innovation, further supporting its technology development efforts.
The funding reflects growing investor confidence in Southeast Asia’s semiconductor ambitions as countries across the region seek to attract high-value chip manufacturing and packaging operations amid evolving geopolitical dynamics.
