Powering up India’s chip game, a $12 million tie-up between HorngCom and RRP Electronics promises faster production, advanced ICs, and a leap in self-reliance.
HorngCom Technology, a subsidiary of AMB Taiwan, has formed an alliance with Maharashtra-based RRP Electronics following a detailed technical review of the latter’s semiconductor facility in Mahape.
The collaboration is expected to generate approximately $12 million in revenue for the current financial year, signalling a major boost for India’s growing semiconductor sector.
HorngCom’s experts inspected RRP’s OSAT (outsourced semiconductor assembly and test) plant and gave the green light for it to undertake operations on behalf of HorngCom Taiwan. This includes the introduction of a new production line under Level 1 of the OSAT facility, which will handle increased volumes with improved efficiency and output.
Under this agreement, HorngCom will delegate various semiconductor services and integrated circuit (IC) product lines to RRP. These include SIM cards, memory modules such as NAND chips, MOSFETs, and other advanced IC products.
The facility upgrade is intended to support these assignments and meet the rising demand for cutting-edge semiconductor components.
RRP Electronics’ Chairman Rajendra Chodankar stated the collaboration would foster innovation and contribute significantly to the company’s growth over the next two quarters. He added that this move supports India’s broader goal of achieving technological self-reliance.
Elmer LingHu, Chairman of HorngCom Technology, described the partnership as part of the firm’s global expansion strategy to offer reliable, high-quality semiconductor services. He highlighted India’s vast potential and said that the cooperation with RRP would help realise important growth milestones.
