By July 2025, Kaynes Semicon will unveil India’s first packaged semiconductor chip. The first batch will go to the US’s Alpha Omega Semiconductor, their partner.
Indian semiconductor company, Kaynes Semicon, based in Mysuru, is set to deliver India’s first packaged semiconductor chip by July 2025. According to a report by the Economic Times, CEO Raghu Panicker confirmed that the pilot production line is nearly complete.
Machinery and cleanroom facilities will be operational by May 2025. Qualification testing is scheduled for June, with the first batch of chips going to US-based Alpha Omega Semiconductor in July.
Kaynes has secured a multi-year agreement with Alpha Omega. The agreement will see Alpha Omega use 60 per cent of the plant’s capacity in the first phase. This partnership will focus on packaging and testing products like IGBT, IPM, and power MOSFET chips.
Moreover, the plant in Sanand, Gujarat, will produce up to 6.3 million chips per day. Kaynes received approval for the OSAT facility in September 2024, with an investment of ₹33.07 billion.
India is attracting significant global investment in its semiconductor sector. In February 2025, U.S.-based Lam Research announced plans to invest over ₹100 billion (approximately US$1.2 billion) in Karnataka.
Kaynes’ project is one of four approved by the Indian government’s ISM (India Semiconductor Mission) for chip assembly plants. Other approved companies include CG Power, Tata Electronics, and Micron. Tata Electronics is also building India’s first wafer fabrication unit. Micron’s plant in Sanand, initially set to open in 2024, has been delayed to early 2025.
