The EM Asia Innovation Awards, known to recognise new technologies and solutions in the Asian electronics manufacturing industry, has recognised Indium for their soldering products.
US Headquartered Indium Corporation, known for electronics, semiconductors, and thermal management has received Electronics Manufacturing (EM) Asia Innovation Awards for two of its products. The awards were presented at the Productronica China trade show in Shanghai.
The first product, CW-807RS, is a halogen-free flux-cored wire. The Company claims that it is designed to improve soldering quality in electronics assembly and robotic soldering.
According to Indium, it helps create stronger and more consistent solder joints, claiming to improve wetting speed and reducing cycle time. The product also includes spatter-control and heat-resistance features, which help keep both components and equipment cleaner, even at higher temperatures.
The second product, Indium12.9HF, is a solder paste, developed for fine-feature printing for small components like 01005 packages. Indium claims that it offers high stencil print efficiency and supports a wide range of processes, which can improve solder paste inspection (SPI) yields.
The company said the product also delivers low voiding performance, which helps in better thermal management. It also has high oxidation resistance, ensuring stable performance during reflow in demanding thermal conditions.
Tim Twining, VP Sales, Indium Corporation, said the awards reflect the company’s focus on solving practical manufacturing challenges. He added that both products are designed to meet current performance and reliability requirements in electronics manufacturing.
