The agreement covers local manufacturing of MEMS microphones for wearables and semiconductor modules for industrial and energy use.
Infineon Technologies signs MoU with Kaynes Semicon, in agreement launching MEMS microphone with Infineon’s bare die and Kaynes managing the packaging and integration.
“The launch of our first made-in-India MEMS microphone marks a milestone for the local semiconductor ecosystem,” added Raghu Panicker, CEO, Kaynes Semicon.
The MEMS microphone, targeted for use in true wireless stereo (TWS) earbuds, will be manufactured at Kaynes’ new facility in Gujarat. This marks a step toward establishing domestic capabilities in semiconductor module manufacturing for next-generation wearable devices.
As part of the agreement, Infineon will also supply high-performance power solution bare dies, which Kaynes will package into discrete and modular components for the Indian market. The move is to support India’s aim to strengthen local manufacturing capacity, reduce import dependency, and establishing vertical integration of electronics supply chain.
In addition to wearable technologies, the partnership will support sectors including renewable energy, industrial automation, and consumer electronics. Applications will span from solar and wind energy systems to smart appliances and manufacturing infrastructure.
“This partnership will strengthen India’s position in the global semiconductor value chain,” said CS Chua, President and Managing Director, Infineon Technologies Asia Pacific.
Kaynes Semicon focuses on developing indigenous semiconductor packaging aligned with India’s electronics manufacturing policies. Infineon reported €15 billion in global revenue for FY 2024 and employs over 58,000 people.
The collaboration positions both companies to meet rising domestic and global demand for energy-efficient, high-performance electronic components across strategic industries.
