The announcement comes as India continues to offer billions of dollars in incentives to attract semiconductor investment
Intel (INTC, Financials) and U.S.-based 3DGS have recently announced plans to invest approximately $3.3 billion to build a semiconductor substrate manufacturing plant in Odisha, India. This step showcases the country’s efforts to expand its chip industry.
The facility will be made in the Bhubaneswar-Khurda region. It might take the next five to six years, and it will also create many job opportunities for locals.
The main focus of this manufacturing plant will be on advanced packaging, glass-core substrates, high-density interconnect substrates and related semiconductor technologies. Substrates serve as the foundation on which semiconductor components are assembled, making them a critical part of the chip manufacturing process.
The announcement comes as India continues to offer billions of dollars in incentives to attract semiconductor investment and build a stronger domestic electronics supply chain.
For Intel, the project expands its manufacturing footprint in one of the world’s fastest-growing technology markets while supporting broader efforts to diversify semiconductor production beyond traditional hubs.
