The upcoming facility will offer a shared Infrastructure-as-a-Service (IaaS) environment.
International SubFAB Research Labs (ISRL USA) and AI Infrastructure Partners (AIIP) have signed a memorandum of understanding to design, build and operate the United States’ first purpose-built research and development facility focused on semiconductor subfab infrastructure. The initiative is aimed at enabling more sustainable and high-volume semiconductor manufacturing at scale.
According to the partners, the platform will cater to a wide ecosystem, including independent device manufacturers (IDMs), foundries, OEMs, subfab suppliers, materials companies and research institutions. The facility is expected to serve as a collaborative space for advancing critical subfab technologies that support semiconductor production.
Under the agreement, AIIP will be responsible for designing, building and owning the facility and its infrastructure. ISRL USA, on the other hand, will lead technical operations, oversee research programmes, and manage the industry-neutral, multi-member platform.
The upcoming facility will offer a shared Infrastructure-as-a-Service (IaaS) environment. This will allow semiconductor companies to carry out pre-competitive research, validate emerging technologies, and generate compliance-ready data, helping accelerate innovation and standardisation across the industry.
