With this move, LTSCT aims to strengthen India’s position in the global semiconductor landscape by contributing to open chiplet standards
L&T Semiconductor Technologies Ltd (LTSCT), a wholly owned subsidiary of Larsen & Toubro, has joined the imec ‘Automotive Chiplet Program’ (ACP), a global pre-competitive initiative aimed at advancing chiplet-based architectures for the automotive industry.
The ACP brings together key stakeholders across the semiconductor and automotive value chain to evaluate chiplet architectures and advanced packaging technologies. The program focuses on addressing the growing requirements of modern vehicles, including high performance, functional safety, reliability, and long lifecycle demands, while enabling scalability and cost efficiency.
With increasing complexity in automotive electronics, traditional monolithic system-on-chip (SoC) designs are facing limitations, especially in applications such as advanced driver-assistance systems (ADAS), software-defined vehicles (SDVs), and next-generation in-vehicle infotainment (IVI). Chiplet-based designs—modular silicon blocks integrated using advanced 2.5D and 3D packaging—are emerging as a viable solution, offering improved performance per watt, faster development cycles, and enhanced supply-chain resilience.
Sandeep Kumar, Chief Executive of LTSCT, said that chiplets represent a fundamental shift in delivering performance and integration in automotive systems. He highlighted that as vehicles become more software-defined, modular and scalable hardware platforms are becoming essential.
He added that through collaboration with imec and ACP partners, LTSCT aims to contribute to defining industry standards and reference designs for next-generation automotive platforms. The company will focus on safety-critical compute partitions, high-bandwidth die-to-die interconnects, and robust testing and monitoring solutions across the product lifecycle.
Welcoming LTSCT into the program, Bart Placklé, Vice President of Automotive Technologies at imec, said that the transition to chiplet architectures requires industry-wide collaboration to be commercially viable. He noted that standardized and interoperable chiplet ecosystems can reduce vendor lock-in, enhance flexibility in supply chains, and improve energy efficiency in automotive platforms.
The ACP leverages imec’s expertise in advanced packaging technologies along with its extensive global ecosystem of semiconductor and automotive partners.
With this move, LTSCT aims to strengthen India’s position in the global semiconductor landscape by contributing to open chiplet standards and collaborating with global innovators to enable safer, smarter, and more sustainable mobility solutions.
