Racing into the 2nm era, MediaTek, Apple, AMD and Nvidia line up with TSMC, as the chip giant expands capacity for next-gen processors worldwide.
Taiwan Semiconductor Manufacturing Co. (TSMC) is preparing to ramp up production of its 2nm process in the second half of 2025, with several major clients already signed up. Accordig to a report by TrendForce, Taiwan’s MediaTek on Thursday confirmed the successful tape-out of its first flagship system-on-chip (SoC) using the advanced node, with mass production targeted for late 2026.
Although the company has not named the chip, industry reports suggest it could be the next Dimensity 9 series processor, possibly branded the Dimensity 9600. This would mark MediaTek’s first flagship offering built on 2nm technology.
Apple is also expected to be an early adopter. According to the Commercial Times, the iPhone 18 due in 2026 will feature the A20 chip and Apple’s in-house C2 modem on TSMC’s 2nm node. The upcoming MacBook M6 and Vision Pro R2 are likewise tipped to use the same process, indicating a broad deployment across Apple’s product range.
To meet growing demand, TSMC is expanding both 2nm and WMCM (Wafer-Level Multi-Chip Module) capacity. Industry sources suggest monthly output could reach 40,000 wafers by the end of 2025 and approach 100,000 wafers in 2026. WMCM capacity is projected at up to 80,000 units by late 2026, mainly through upgrades to existing InFO packaging facilities.
The 2nm platform introduces gate-all-around (GAA) nanosheet architecture while maintaining extreme ultraviolet (EUV) layer counts similar to 3nm, enabling a more cost-efficient structure. Compared with TSMC’s N3E process, the node offers 1.2× higher logic density, performance improvements of up to 18% at equal power, or power savings of about 36% at equal speed.
Other industry players are also eyeing the node. AMD’s forthcoming ‘Venice’ HPC product is expected to debut on 2nm, while NVIDIA reportedly plans to adopt the A16 chip for its next-generation Feynman architecture.
