The collaboration covers Synopsys’ 3D electromagnetic field analysis tool
Murata Manufacturing has partnered with Synopsys. This partnership will provide users of Synopsys’ simulation tools with direct access to Murata’s website to download the latest high-performance simulation models.
The collaboration covers Synopsys’ 3D electromagnetic field analysis tool, Ansys HFSS™, and thermal analysis tool, Ansys Icepak®, and marks a significant step toward streamlining the simulation workflow for electronic circuit designers. Murata is also the first company to offer passive component simulation models via Ansys Icepak*.
As the demand for faster and higher-capacity communication systems continues to rise, electronic circuit design is becoming increasingly complex. Engineers are now required to consider multiple physical factors, including electromagnetic interference (EMI) and heat generation, within a single design environment. Addressing these challenges at an early stage is crucial, as failure to do so can lead to expensive redesigns, longer development cycles, and increased prototyping costs. Consequently, there is growing demand for electronic component manufacturers to deliver high-quality, ready-to-use simulation models that integrate seamlessly with the design tools engineers already use.
Creating accurate simulation models for electromagnetic and thermal analysis remains a significant challenge because both electromagnetic characteristics and temperature behaviour can vary substantially depending on operating and design conditions. Murata addresses this through its vertically integrated business model, which encompasses everything from raw material development and manufacturing to final product processing. This approach enables the company to leverage extensive proprietary data, resulting in simulation models that closely mirror real-world component performance.
The newly released models are compatible with Ansys 2026 R1. For electromagnetic field analysis, Ansys HFSS supports Murata’s RF inductors and multilayer ceramic capacitors (MLCCs), while Ansys Icepak enables thermal analysis of Murata’s power inductors.
Going forward, Murata plans to strengthen its collaboration with Synopsys and further expand its portfolio of simulation models, helping engineers accelerate development and create more advanced, efficient electronic systems.
