The first U.S.-made Blackwell wafer from TSMC adds new capacity to global advanced semiconductor chip production.
NVIDIA starts the production of its Blackwell wafer in the US, marking a new phase in semiconductor manufacturing for both NVIDIA and TSMC. The wafer is produced at TSMC’s fabrication facility in Phoenix, Arizona.
“This milestone is built on three decades of partnership with NVIDIA, to go from arriving in Arizona to delivering the first U.S.-made NVIDIA Blackwell chip in just a few short years represents the very best of TSMC,” said Ray Chuang, CEO of TSMC Arizona.
The development comes amid broader US efforts to strengthen its semiconductor supply chain and reduce dependence on overseas production. The Arizona site forms part of TSMC’s global network of advanced fabs that manufacture chips for applications including AI, cloud infrastructure, and data analytics.
The Arizona facility produces advanced semiconductor nodes, including 2nm, 3nm, and 4nm chips, and prepares for future A16 process production.
NVIDIA’s founder and CEO, Jensen Huang, says the milestone shows how advanced chip manufacturing is taking place inside the United States for the first time in recent years. He notes that producing chips locally is part of a broader effort to strengthen supply chains, create technical jobs, and support the country’s industrial base in computing hardware.
The Blackwell wafer will undergo several manufacturing stages, including layering, patterning, and etching, before it becomes a finished chip. Once complete, it will be used for AI inference, cloud computing, and high-performance data processing systems.
NVIDIA also plans to integrate its own AI, robotics, and digital twin technologies to manage future manufacturing sites, linking production processes with its broader AI development infrastructure.
