Amid India’s semiconductor push, Odisha has unveiled its first advanced 3D chip packaging unit, set to boost innovation, jobs, and critical technology sectors.
Odisha broke ground on April 19, 2026, on India’s first advanced 3D chip packaging facility in Bhubaneswar. The project, known as Heterogeneous Integration Packaging Solutions (3D Glass Solutions), introduces glass substrate-based packaging technology to India for the first time.
The ceremony was attended by Odisha’s Chief Minister Mohan Charan Majhi, Union Minister for Railways, Information & Broadcasting and Electronics and IT Ashwini Vaishnaw, and Odisha’s Electronics and IT Minister Dr Mukesh Mahaling. Senior government officials, industry leaders, investors and academics also participated.
According to a PIB release, this initiative marks the arrival of advanced chip packaging technology in India, positioning Odisha at the forefront of next-generation semiconductor innovation. Approved by the Union Cabinet months earlier, the project has moved rapidly towards implementation. With an investment of approximately ₹19.43 billion, the unit is expected to generate around 2500 direct and indirect jobs.
The facility will have an annual production capacity of 50 million assembled units, serving critical sectors including aerospace, defence, artificial intelligence (AI), 5G technologies and data centres.
It is designed to deliver advanced 3D heterogeneous integration modules, a technology regarded as crucial for high-performance computing and emerging applications.
With this, Odisha will become the first state in India to host both a compound semiconductor fabrication unit and a 3D chip packaging facility based on glass substrates.
