Amid a crucial phase of Europe’s semiconductor push, Bosch veteran Michael Budde takes charge of the European Semiconductor Industry Association.
Bosch executive Michael Budde has been elected the new President of the European Semiconductor Industry Association (ESIA), following a vote by the organisation’s General Assembly in Brussels on 10 December 2025. He will serve a two-year term, succeeding Infineon Technologies’ CEO Jochen Hanebeck.
ESIA represents the shared interests of Europe’s semiconductor sector and acts as the industry’s voice before EU institutions and policymakers. Its members include chipmakers, suppliers and research organisations.
Budde is President of Mobility Electronics at Bosch and has been divisional chief since October 2022. His career at the company spans more than 25 years. It includes experience in electrical drives, battery technologies, and senior sales and marketing roles, including an international posting in the United States (US).
Under his leadership, Bosch has expanded its semiconductor capabilities across both consumer and mobility markets, with his automotive background and relationships with manufacturers.
Budde holds a mechanical engineering degree from the Rheinische Fachhochschule in Cologne.
After his appointment, Budde said he was honoured to lead ESIA at a pivotal moment for Europe’s chip sector.
“Semiconductors are at the heart of Europe’s technological sovereignty and global competitiveness – truly an ‘industry of industries’. Today, we face exciting opportunities and significant challenges: from scaling up manufacturing at foundational and advanced nodes and securing resilient supply chains to addressing talent shortages and sustainability requirements,” he said.
Budde also stressed the role of chips in AI, innovation and the green transition.
Europe is preparing a series of significant policy decisions that will shape the industry’s direction, including negotiations on the EU’s long-term budget, a second Chips Act, and new regulations governing essential chemicals.
Budde said his focus will be on strengthening collaboration across the semiconductor ecosystem, ensuring effective implementation of the EU Chips Act and championing innovation that supports growth and strategic autonomy.
