Aiming to revolutionize chip design, RAAAM Memory Technologies raised $17.5 million in Series A funding led by NXP Semiconductors.
RAAAM Memory Technologies, a startup developing next-generation on-chip memory, has raised $17.5 million in an oversubscribed Series A round led by NXP Semiconductors. The funding round also included participation from a leading multinational networking corporation, IAG Capital Partners, EIC Fund, LiFTT, Alumni Ventures, and existing investors such as J-Ventures, Silicon Catalyst Ventures, and Serpentine Ventures. The new investment brings RAAAM’s total funding to over $24 million, including equity and a grant from the EIC Accelerator program.
The funds will be used to advance the qualification of RAAAM’s patented GCRAM technology in leading-edge process nodes at top-tier semiconductor foundries. RAAAM has already demonstrated its GCRAM on silicon and is collaborating closely with NXP to prepare the technology for mass production.
“This oversubscribed funding round with high-profile strategic and financial investors is another sign of confidence in our company and our revolutionary technology,” said Robert Giterman, CEO and co-founder of RAAAM. “Our solution promises to resolve the memory bottleneck in advanced AI chips through significant memory density improvement and lower power consumption compared to SRAM.”
NXP’s Victor Wang said, “We’ve collaborated with RAAAM for several years and have seen first-hand the potential of their on-chip memory technology.”
EIC Fund Chair Svetoslava Georgieva added, “RAAAM’s breakthrough directly addresses a critical challenge in the semiconductor value chain, supporting Europe’s leadership in strategic technologies.”
