Driving faster chip innovation, Siemens and TSMC deepen AI-led EDA collaboration, enabling advanced-node design, 3D IC validation and next-generation semiconductor workflows.
Siemens has expanded its collaboration with Taiwan Semiconductor Manufacturing Company (TSMC) to advance artificial intelligence (AI)-driven automation across semiconductor design workflows, with a focus on improving efficiency at advanced process nodes.
The companies said the partnership will extend AI integration across electronic design automation (EDA), including automated design rule check (DRC) fixing and the deployment of Siemens’ Fuse EDA AI system. The system is designed to streamline multi-step processes in chip design, enabling faster verification and implementation cycles.
As part of the collaboration, Siemens’ EDA tools have received certifications to support TSMC’s latest process technologies, including N3A, N3C, N2P, A16 and A14. These certifications are intended to ensure compatibility and reliability for customers developing chips on advanced manufacturing nodes.
In the area of 3D integrated circuit (IC) design, Siemens’ Calibre software suite has been aligned with TSMC’s 3DFabric technologies. This includes tools for validating chiplet connectivity, performing inter-chiplet design rule checks, and analysing thermal and electrical performance in stacked semiconductor designs.
The Calibre 3DThermal tool has also been certified for both static and transient thermal analysis, supporting design decisions for complex multi-die systems.
The partnership further extends to simulation and verification. Siemens’ Solido Simulation Suite has been certified for SPICE accuracy across multiple TSMC nodes, supporting analogue, mixed-signal, RF and memory designs. Additional capabilities include reliability-aware simulation addressing factors such as device ageing and thermal effects.
Other Siemens tools, including Aprisa for digital implementation and mPower for electromigration and IR drop analysis, have also achieved certification for TSMC’s advanced processes.
Beyond traditional chip design, the companies are collaborating on silicon photonics and on enabling support for TSMC’s Compact Universal Photonic Engine technology, which aims to integrate optical and electronic components within semiconductor systems.
