The company plans to use the new funding to expand into the United States and move toward large-scale production.
Syenta has raised $26 million in Series A funding to scale its advanced chip packaging technology. The round was led by Playground Global and Australia’s National Reconstruction Fund, with support from investors like Investible, Salus Ventures, Jelix Ventures, and Wollemi Capital.
With this, Syenta’s total funding has crossed $36 million. As part of the deal, Pat Gelsinger from Playground Global will join the company’s board.
The company is working on improving how computer chips connect and communicate, which is becoming a major challenge as AI systems grow more powerful. Current chip designs struggle with efficient data transfer between chips, slowing performance.
Syenta’s solution is a new process called Localized Electrochemical Manufacturing (LEM). This technology enables high-density connections between chips, helping systems move data faster and more efficiently. It can also reduce manufacturing steps by about 40% and does not require major changes to existing chip factories.
The company plans to use the new funding to expand into the United States and move toward large-scale production. It is also setting up operations in Arizona to work closely with semiconductor companies and customers.
Industry experts say advanced packaging is now one of the biggest challenges in scaling AI systems. By improving chip connectivity, Syenta aims to make high-performance computing more efficient and accessible while strengthening global semiconductor supply chains.
