To develop cutting-edge tech solutions, including advanced chips for AI, 5G, and 6G, Bengaluru’s Terminus Circuits teams up with SRAM & MRAM, boosting India’s self-reliance.
Terminus Circuits Private Limited, a Bengaluru-based firm, has partnered with SRAM & MRAM, a UK-based technology company, to develop import-substituting and export-oriented intellectual properties and products.
According to the company, this move aligns with India’s goal of self-reliance within the component sector.
The collaboration will focus on innovating high-throughput, low-latency flagship devices and application-specific integrated circuits (ASICs), catering to the increasing demand for cutting-edge technological solutions.
Combining SRAM & MRAM’s global reach and financial resources with Terminus Circuits’ expertise in high-speed interface technologies—such as PCIe, USB, MIPI, and Ethernet—the partnership aims to create advanced networking chips, NVMe storage devices, and hardware components for artificial intelligence (AI) systems.
Furthermore, these innovations will support the development of 5G and 6G applications.
Both companies are excited about the potential of this collaboration, which aligns with their shared vision of enhancing capabilities and market positioning.
“We are excited about the potential of this collaboration complementing the strengths of each other to strengthen our capabilities and position in the market, ultimately delivering exceptional value to our customers and contributing to India’s self-reliance in technology,” Terminus mentioned in their official statement.
With plans to further strengthen the relationship, the companies hope to take their collaboration to the next level by focusing on complete system developments within India, which is in line with SRAM & MRAM’s semiconductor growth strategy for the region.
Terminus Circuits provides high-speed serial link interface and interconnect solutions across multiple standards like USB, PCIe, and SATA, with integrated clocking for high-performance computing systems.