This partnership will deliver a flexible, user-friendly platform that enhances the user experience while prioritizing safety and efficiency.
Tessolve has announced a strategic collaboration with NXP Semiconductors, aiming to expedite the implementation of a cutting-edge Digital Connected Cluster (DCC) solution specifically designed for mass-market vehicles. This partnership brings together Tessolve’s engineering prowess and NXP’s semiconductor expertise to deliver a Digital Connected Cluster platform that seamlessly integrates into two-wheelers and three-wheelers. The heart of this sophisticated system is NXP’s i.MX RT1170 crossover MCU, complemented by the AW611 Wi-Fi/Bluetooth combo chip, KW45 Bluetooth LE smart access MCU, and PF5103 multi-channel PMIC, providing a feature-rich solution for Original Equipment Manufacturers (OEMs).
The Digital Connected Cluster, powered by NXP’s i.MX RT1170-based SMARC SoM boasts a 5-inch display, which can be upgraded to a 7-inch version, and is outfitted with state-of-the-art chipsets enabling BLE and Wi-Fi 6 connectivity, alongside a multi-channel power management system and CAN interface, making it a comprehensive, production-ready package.
Dan Loop, Vice President and General Manager of Automotive Edge Product Lines at NXP, highlighted the crucial role of high-resolution digital displays in ensuring the safe operation of electric vehicles. He emphasized that the new DCC solution offers advanced graphics, smartphone connectivity, and essential vehicle information, all within a cost-effective system, thereby enhancing the driving experience and safety for EV operators.
Echoing this sentiment, Kiran Kumar Nagendra, AVP- Embedded Systems at Tessolve, elaborated on the flexibility of the new digital cluster, which is built on Tessolve’s 3-D product engineering principle. This framework ensures that the solution can be adopted ‘as is’ or customized to meet specific OEM needs, significantly accelerating the time-to-market for new vehicle models.
