The expanded collaboration highlights how silicon carbide power technology is enabling faster charging, improved efficiency, and scalable electric vehicle platforms.
onsemi has strengthened its strategic collaboration with Chinese electric vehicle manufacturer NIO Inc. to accelerate the development of next-generation EV platforms based on high-voltage architectures. The expanded partnership focuses on supporting NIO’s transition from existing 400V systems to advanced 900V electric vehicle platforms using onsemi’s latest EliteSiC enhanced M3e silicon carbide technology.
The companies say the move reflects growing industry demand for higher efficiency, faster charging capability, and improved vehicle performance. Onsemi’s EliteSiC M3e devices are designed to improve switching efficiency and reduce energy losses within the powertrain while maintaining strong durability under high electrical stress. These improvements enable better thermal management and overall drivetrain efficiency, helping extend driving range, deliver consistent acceleration performance, and support ultra-fast charging capabilities.
The collaboration builds on a long-standing relationship in which onsemi’s silicon carbide solutions were previously deployed in NIO’s 400V vehicle platforms. The partnership has now evolved into deeper system-level engineering cooperation as NIO introduces new 900V vehicle architectures, including upcoming models such as the ES9 SUV expected to debut at the 2026 Beijing Auto Show.
According to onsemi CEO Hassane El-Khoury, the automotive industry is entering a phase where efficiency, scalability, and faster development cycles are becoming central to electrification strategies. By aligning technology roadmaps with automakers, semiconductor suppliers can help accelerate adoption of high-voltage EV platforms.
Alan Zeng, head of NIO’s powertrain division XPT, noted that collaboration with semiconductor partners has been critical in advancing vehicle performance and reliability as the company moves toward more power-intensive architectures.
The expanded partnership highlights a broader industry trend toward closer integration between automakers and chip companies. As electric vehicles evolve toward higher-voltage systems and advanced electric drive technologies, deeper collaboration is becoming essential to shorten development timelines and bring next-generation EV platforms to market more efficiently.
