The agreement establishes a framework for TSMC to procure advanced packaging and testing services from Amkor.
Taiwan Semiconductor Manufacturing Company and Amkor Technology have signed a 10-year deal to encourage a strong partnership that will boost advanced semiconductor packaging capabilities in Arizona, strengthening and accelerating investment in the U.S. semiconductor supply chain ecosystem.
The agreement establishes a framework for TSMC to procure advanced packaging and testing services from Amkor.
By collaborating to expand manufacturing capacity, the two companies aim to create a more efficient and mutually beneficial operating model while enhancing their ability to address customers’ evolving needs.
With growing demand for high-performance computing (HPC), artificial intelligence (AI), and advanced electronics, advanced packaging has emerged as a key driver of system-level performance and integration. Through this partnership, the region’s advanced semiconductor packaging capacity is expected to increase, enabling faster time-to-market for customers.
“We are pleased to enter into this Agreement with our partner Amkor,” said Kevin Zhang, Senior Vice President and Deputy Co-COO of TSMC. “We have a long history of collaborating with Amkor on advanced packaging technologies worldwide, and we are confident that our partnership in the United States will further strengthen our ability to serve customers together.”
This partnership might provide more support for the semiconductor supply chain and deliver benefits to customers across diverse end markets.
“This Agreement represents another important milestone in our partnership with TSMC as we advance semiconductor manufacturing capabilities in the United States,” said Kevin Engel, CEO of Amkor Technology. “By combining advanced wafer fabrication with packaging and testing services, we can offer customers a comprehensive U.S.-based semiconductor supply chain.”
The partnership showcases both companies’ dedication to strengthening semiconductor manufacturing in Arizona.
While Amkor continues developing its advanced packaging and test campus, TSMC is expanding its state-of-the-art fabrication facilities in the state. Together, these investments are expected to reinforce the United States’ semiconductor ecosystem and support long-term industry growth.
