TSMC secures permits for 1.4nm fabs in central Taiwan, as construction starts and risk assessments are scheduled for completion by 2027.
Taiwan Semiconductor Manufacturing Co (TSMC) is preparing to begin construction of its 1.4-nanometre chip fabrication facilities in October at the Central Taiwan Science Park in Taichung. The company secures land for the project in June as part of the second phase of the park’s expansion.
TSMCs plan for a construction of its new lab for designated Fab 25, which would feature the four new chip fabs. The first fab is expected to complete wafer production risk assessments by the end of 2027, with mass production scheduled for the second half of 2028 and a target monthly output of 50,000 wafers.
Cement, construction and engineering firms in central Taiwan are receiving bids linked to TSMC’s upcoming facilities. Supply-chain companies estimate business opportunities in engineering, equipment, materials, and back-end packaging and testing could reach $98.1 million.
The expansion comes as global foundry competition intensifies. Samsung Electronics promotes its sub-2-nanometre process technology and aims to start mass production this year. TSMC advances its 1.4-nanometre process to reinforce its position in next-generation semiconductor manufacturing.
The Central Taiwan Science Park administration confirms that public works for the expansion, including water detention ponds and soil and water conservation structures, are scheduled for completion by the end of September. TSMC holds the required permits and plans to break ground on the first of four 1.4-nanometre fabs as soon as the work is completed.
