TSMC is advancing its next-generation 2nm (N2) technology, with a pilot production line now being established at its Hsinchu Baoshan fab (Fab 20) this quarter.
TSMC is ramping up its efforts to meet growing demand for 2nm semiconductor technology, with a projected monthly capacity of over 50,000 wafers by the end of 2025 and a significant leap to 120,000–130,000 wafers per month by the close of 2026. These targets will be achieved through contributions from its new facilities, including the Hsinchu Baoshan fab and the Kaohsiung fab (Fab 22).
The Hsinchu Baoshan fab is on track to deliver 20,000–25,000 wafers monthly by Q4 2025, scaling up to 60,000–65,000 wafers per month by late 2026 or early 2027. Similarly, the Kaohsiung fab aims to achieve 25,000–30,000 wafers per month by the end of 2025, with plans to expand to 60,000–65,000 wafers monthly in the subsequent year.
TSMC Chairman C.C. Wei emphasized that customer demand for 2nm technology is poised to surpass the adoption rate of 3nm, driving the company’s robust investment in production capacity. Apple has been confirmed as the first adopter of TSMC’s 2nm technology, with other major players, including MediaTek, Qualcomm, Intel, NVIDIA, AMD, and Broadcom, expected to follow suit.
At the recent IEEE International Electron Devices Meeting (IEDM), TSMC highlighted the advanced features of its N2 technology. It offers a 24%–35% reduction in power consumption or a 15% performance boost at the same voltage compared to its 3nm predecessor. Additionally, transistor density in 2nm technology is 1.15 times higher than 3nm, reinforcing TSMC’s position at the forefront of semiconductor innovation.
As the industry shifts toward more energy-efficient and high-performance chips, TSMC’s aggressive expansion plan for its 2nm technology underscores its commitment to maintaining technological leadership and meeting escalating global demand.
