Set to produce 55,000 wafers monthly by 2029, VIS and NXP’s joint venture VSMC’s $7.8 billion semiconductor facility in Singapore breaks ground.
VisionPower Semiconductor Manufacturing Company (VSMC), the joint venture formed in September 2024 by Vanguard International Semiconductor Corporation (VIS) and NXP Semiconductors, recently laid the foundation of its new wafer manufacturing facility in Tampines, Singapore, with an investment of $7.8 billion.
With production slated to begin in 2027, the fab is projected to output 55,000 300mm wafers per month by 2029. The site will feature an automated production model incorporating AI-driven quality management, offering efficient manufacturing.
Furthermore, it is expected to create approximately 1500 jobs and foster business opportunities for local enterprises.
The company has also stated that the facility will adhere to Singapore’s Green Mark standards, incorporating energy-efficient systems and sustainable design elements.
Customers, suppliers, partners, government officials, and other key stakeholders attended the ceremony, which was marked by Dr Tan See Leng, Singapore’s Minister for Manpower and Second Minister for Trade and Industry.
VSMC Chairman Leuh Fang highlighted the facility’s significance, stating, “We are proud to announce the groundbreaking of our first 12-inch fab in Singapore, which will uphold the company’s core business philosophy, provide specialty IC (integrated circuit) foundry services.”
NXP President and CEO Kurt Sievers expressed excitement for the facility’s swift progress, stating that it aligns with NXP’s hybrid manufacturing strategy, supporting supply control and geographic resilience.
Ms. Cindy Koh, Executive Vice President of Singapore’s Economic Development Board, welcomed the joint venture, underscoring Singapore’s appeal to global companies and its vital hub in the semiconductor supply chain.
The venture follows the June 5 announcement and the official establishment of VSMC in September after regulatory approvals were secured.
