MeitY announces Aheesa and CalligoTech under futureDESIGN DLI, promising a semiconductor revolution.
Amid the buzzing atmosphere of SemiconIndia 2023 in Gandhinagar, the Ministry of Electronics and IT (MeitY) dropped a significant update. Spotlighting two semiconductor design startups, Aheesa Digital Innovations and Calligo Technologies, the ministry reinforced its commitment under the SemiconIndia futureDESIGN DLI scheme. This is the dawn of a transformative semiconductor landscape in India.
Aheesa, hailing from Chennai, showcases a robust foundation in Telecom, Networking, and Cyber Security. Spearheaded by founders with a solid 40 years in technology, their objective is clear: launching the Aheesa Vihaan series of Networking SoCs, India’s homegrown marvels. An intriguing facet of the premiere Aheesa Vihaan leans on C-DAC’s VEGA Processor Core, fueled by the RISC-V architecture. Aheesa is poised to roll out the GPON/EPON ONT reference platform, catering to India’s telecom and network titans.
CalligoTech, rooted in Bengaluru, operates at the confluence of HPC, Big Data, and AI/ML, serving global giants. Their mission is enhancing computing through software and hardware acceleration. Their latest, a computational accelerator using a groundbreaking number system, POSITs, promises to redefine computing standards. Calligo’s ambitious plan marries a RISC V Processor with this co-processor, unveiling the efficient TUNGA Silicon. The result is a PCIe-based Accelerator Card, UTTUNGA, is tailored for HPC/AI workloads.
DLI, steered by C-DAC, extends financial incentives and infrastructural backing for semiconductor design across various development stages spanning five years. The ChipIN centre, a one-stop hub under DLI, extends chip design & fabrication services to beneficiaries. With today’s news, seven startups now operate under the DLI umbrella, crafting chips and IP cores for the automotive, mobility, and computing sectors.
