Joint marketing of high-voltage IGBT and SiC products, technical training for diode manufacturing, and setting up a facility to produce 100 million units annually, boosting India’s Semiconductor Mission.
Hitachi Power Semiconductor Device, Ltd. (HPSD) and Sagar Semiconductors (Sagar Semi) recently signed a Memorandum of Understanding (MoU) to enhance their collaboration in the semiconductor sector. This agreement aims to bolster joint marketing for high-power devices like IGBTs and SiC, engage in new product development (NPD), and facilitate technology transfer specifically for high voltage diodes. The MoU was signed at Sagar Semiconductors’ headquarters in Hyderabad, marking a significant step in strengthening India’s semiconductor capabilities as part of the nation’s ‘Make in India’ initiative.
The partnership focuses on three main areas:
- Joint Marketing Efforts: HPSD and Sagar Semi will collaborate on marketing strategies for high voltage SiC and IGBT products. This collaboration is intended to complement and expand Sagar Semi’s existing product range, which includes MOSFETs and IGBTs.
- New Product Development (NPD): The alliance aims to develop products tailored to emerging technologies and sectors within India, such as white goods, energy storage solutions (ESS), and railways. This initiative aligns with the goals of fostering local innovation and addressing specific market needs.
- Technical Transfer and Training: Sagar Semiconductors plans to establish a manufacturing facility capable of producing high voltage semiconductors for the automotive industry. HPSD has agreed to support this venture by transferring essential manufacturing technologies and offering training. The proposed facility will be one of the first in India to integrate both the fabrication and packaging stages of semiconductor production, with an expected output of approximately 100 million units annually.
In addition to these key areas, device company is considering relocating some of its production facilities to India and has committed to supporting the establishment of the new manufacturing facility. This support will include comprehensive training for Sagar Semiconductors’ staff in both Japan and India.
Both companies anticipate that this collaboration will significantly enhance India’s semiconductor and power electronics landscape by promoting local manufacturing, improving technological skills, and accelerating product development. Mr. Kedar Reddy, MD of Sagar Semiconductors, and Mr. Hirotaka Wakamatsu, Head of Business Development at HPSD, both expressed strong commitments to this partnership, highlighting its potential to transform India’s position in the global semiconductor market. The collaboration is in line with the objectives of the India Semiconductor Mission (ISM) to create a favorable environment for semiconductor innovation and manufacturing in India.
