As an honour for his remarkable contributions to the semiconductor design industry and inspiring engineers around the globe, Dr Satya Gupta was celebrated with the prestigious ‘Lifetime Achievement Award’ at DVCon 2024.
Dr Satya Gupta was recently honoured with the prestigious ‘Lifetime Achievement Award’ for his exceptional contributions to the semiconductor design industry during the Design and Verification Conference & Exhibition (DVCon), organised by the VLSI Society of India on 18-19 September 2024.
With over four decades of impactful work, Dr. Gupta has been a visionary leader, serial entrepreneur, researcher, and philanthropist. He has previously held leadership positions in organisations like the EPIC Foundation and the India Electronics and Semiconductor Association (IESA). His influence spans semiconductor product design, manufacturing, research, start-ups, and talent development, inspiring millions of young engineers in VLSI and semiconductors in India and worldwide.
Prakash Easwaran, CEO of Green PMU Semi, received the ‘Outstanding Individual Achiever Award’ among other award recipients at the event. Srobona Mitra, Senior Staff Engineer and Manager at Qualcomm was honoured with the ‘Women Achiever Award,’ Samsung India for ‘Exemplary Contributions’ and the Vellore Institute of Technology for ‘Best Academic Institution.’
Held at the Radisson Blu in Marathahalli, Bengaluru, DVCon is a platform for professionals engaged in electronic systems and integrated circuits design and verification. The conference focuses on applying languages, tools, methodologies, and standards practically, promoting advanced techniques to enhance attendees’ design and verification processes.
Sponsored by Accellera Systems Initiative, the event brings together chip architects, design and verification engineers, and IP integrators to explore the latest methodologies and applications in electronic design.
This year, DVCon aimed to strengthen its Technical Program Committee, ensuring a world-class experience for all participants while addressing the challenges of designing increasingly complex 2D and 3D chips, including Chiplets, using AI/ML and other advanced techniques.
