On the second day of SEMICON India, Narendra Modi toured global and Indian booths, unveiled innovations, and rallied CEOs around ISM 2.0’s ambitious roadmap.
Prime Minister Narendra Modi attended the second day of SEMICON India 2025 at Yashobhoomi in New Delhi on Wednesday. He visited the exhibition floor and later took part in a CEO roundtable with industry leaders. The discussions focused on India’s semiconductor roadmap, including the next phase of the India Semiconductor Mission (ISM 2.0).
The exhibition featured booths from global companies such as ASML, Applied Materials, Lam Research, Merck, Tokyo Electron, AMD, and Micron, as well as Indian firms including Tata Electronics and L&T Semiconductor Tech.
Academic institutions such as IIT (ISM) Dhanbad and NIT Rourkela showcased indigenous chip innovations. Visitors also saw the recently unveiled ‘Vikram’ 32-bit processor, described as India’s first fully indigenous microprocessor.
At the CEO roundtable, Modi was joined by Electronics and IT Minister Ashwini Vaishnaw and Minister of State Jitin Prasada. Around 25 industry representatives participated, among them Christophe Fouquet (ASML), Kai Beckmann (Merck), Tim Archer (Lam Research), Toshiki Kawai (Tokyo Electron), Randhir Thakur (Tata Electronics), Sandeep Kumar (L&T Semiconductor Tech), Gursharan Singh (Micron) and Prabhu Raja (Applied Materials).
Officials from Invest India, the India Electronics & Semiconductor Association (IESA), and the Electronic Industries Association of India (ELCINA) also attended, along with representatives of Celesta Capital, which recently launched a $1 billion deep-tech fund aimed at India.
In his remarks, the Prime Minister highlighted India’s ongoing reforms in the semiconductor sector and said industry inputs would shape the government’s policy direction. According to officials, he noted that ISM 2.0 is currently being framed to build on the progress of ISM 1.0, launched in 2020, which has attracted investment commitments worth ₹1.5 trillion across 10 projects at various stages of development.
The range of products and services on display covered nearly the entire semiconductor manufacturing lifecycle. These included fabrication tools, design automation, packaging technologies, photolithography systems, semiconductor materials, and IoT and automotive applications.
Fujifilm showcased materials including photoresists, CMP slurries and high-purity process chemicals, while Sumitomo Chemical presented photoresists, semiconductor chemicals, and analytical services.
Equipment suppliers, such as ASMPT, exhibited advanced tools like the AERO PRO high-performance wire bonder for high-density chip designs.
Additionally, logistics and infrastructure companies such as NX Group were present, underlining the importance of an integrated ecosystem from design through to delivery.
