The proposed venture reflects Japan’s broader strategy to regain relevance in a semiconductor market
Japan’s semiconductor industry is poised for consolidation as ROHM Semiconductor, Toshiba, and Mitsubishi Electric move to establish a joint power semiconductor unit aimed at strengthening global competitiveness. The initiative begins with Toshiba Electronic Devices & Storage Corporation signing a memorandum of understanding with the two partners to explore the collaboration.
The proposed venture reflects Japan’s broader strategy to regain relevance in a semiconductor market increasingly driven by scale. If realised, the combined entity could emerge as the world’s second-largest power chip supplier after Infineon Technologies. Together, the three firms currently hold around 11% of the global power semiconductor market, compared to Infineon’s 24%.
Power semiconductors are critical to high-growth sectors such as electric vehicles, renewable energy, data centres, and industrial automation. Each partner brings complementary strengths: Rohm’s extensive portfolio includes SiC devices crucial for EV systems, Mitsubishi Electric contributes advanced power devices and industrial expertise, while Toshiba TDSC offers MCUs and power management solutions.
The development also intersects with Denso, which holds a stake in Rohm and has reportedly explored acquiring the company to strengthen Toyota’s supply chain. The evolving partnership could reshape Japan’s semiconductor landscape and influence future ownership dynamics.
