Driving India’s chip ambitions, HCL Group and Foxconn partner with CTCI to build a ₹37.06 billion OSAT facility in Jewar, Uttar Pradesh.
HCL Group and Foxconn have appointed CTCI Corporation as the engineering, procurement and construction (EPC) partner for their ₹37.06 billion semiconductor assembly and testing facility in Uttar Pradesh.
The plant, to be located in Jewar near the upcoming Noida International Airport, will focus on producing display driver chips used in mobile phones, laptops, personal computers, and automotive systems.
The project is being developed under the India Semiconductor Mission (ISM) and is expected to generate more than 2000 direct and indirect jobs.
CTCI’s selection is linked to its long-standing association with Foxconn on global industrial projects, including facilities in Taiwan and the United States (US). The contract also marks CTCI’s entry into India’s semiconductor sector, expanding its footprint in a market seeking to build domestic capabilities in chip packaging and testing.
The facility will operate as an OSAT (outsourced semiconductor assembly and testing) unit, a segment considered critical to reducing reliance on imported semiconductor components.
The investment also strengthens Uttar Pradesh’s positioning as an emerging technology and manufacturing hub, particularly through infrastructure developments around Jewar.
Compared with other semiconductor initiatives in India, such as larger fabrication and memory chip projects in Gujarat and Tamil Nadu, the HCL-Foxconn venture focuses on downstream chip packaging and testing.
However, execution risks remain, including land acquisition processes, regulatory clearances and potential supply chain constraints. Industry analysts also point to global competition from established semiconductor ecosystems in Taiwan, South Korea and the US, as well as the need for effective technology transfer between partners.
