Lam Research Opens 470000-Sq-Ft Logistics Hub to Bolster US Chip Supply Chain

Centralised California facility leverages robotic automation to support global AI chip equipment demand and accelerate logistics.

Semiconductor equipment manufacturer Lam Research has opened a 470,000-square-foot logistics hub in Livermore, California—its largest in the United States—to reinforce the semiconductor supply chain and meet rising global demand for AI-enabling technology. The 10-acre site centralises Lam’s regional logistics operations, enabling the business to move essential components efficiently, absorb demand fluctuations, and enhance delivery speed and predictability across advanced fab environments.

Karthik Rammohan, Senior Vice President of Global Operations and Enterprise Solutions at Lam Research, noted: “This warehouse demonstrates Lam’s commitment to investing in the U.S. as part of our global operations strategy.”

The facility directly supplies Lam’s high-volume manufacturing plant in Livermore alongside pilot development projects at its nearby Fremont headquarters. An adjacent metrology laboratory further supports outbound delivery times and regional R&D. By consolidating multiple regional sites into a single location, the company eliminates transport inefficiencies and can dynamically reallocate resources as customer technology ramps evolve. The hub features a 40,000-square-foot automated storage and retrieval system powered by 15 robots, cutting inventory retrieval times from six minutes to under 30 seconds across 150,000 storage bins holding over 500,000 unique part numbers. Operated in partnership with DHL, the facility is projected to support more than 200 jobs by 2027.

Troy Rainey, Director of US Warehouse Operations at Lam Research, added: “With all operations under a single roof, we can create a more agile and efficient operation.”

- Advertisement -
Loading form…
Jaydeep Gadhavi
Jaydeep Gadhavi
Jaydeep Gadhavi is a journalist with EFY business focusing on EV as well as Semiconductor business news.

Industry's Buzz

GlobalFoundries logo

MIPS and Xcelsa Labs Partner to Accelerate Custom Silicon Development

0
Strategic collaboration integrates verified intelligence platforms to cut design iteration cycles for AI, automotive, and robotics hardware. MIPS, a subsidiary of GlobalFoundries, has announced a...

Global Electronics Association and Fraunhofer Partner on EU Chips Act Pilot Line

0
Strategic collaboration aims to standardise advanced packaging and chiplet integration to bridge the gap between pilot-line innovation and mass production. The Global Electronics Association has...

Pulsiv Signs Manufacturing Deal for High-Power USB-C Modules

0
Pulsiv has developed its modules using its patented OSMIUM AC-DC conversion technology UK-based power electronics company Pulsiv has signed an exclusive manufacturing and supply agreement...

TOPPAN Opens First Overseas FC-BGA Substrate Plant in Singapore

0
FC-BGA substrates are used in high-density semiconductor packages TOPPAN Inc. has established its first overseas production facility for Flip Chip Ball Grid Array (FC-BGA) substrates...
Semiconductor (representational image)

Canon India eyes semiconductor equipment opportunity as chip manufacturing expands

0
Canon is also expanding its presence in surveillance and security, medical diagnostic imaging, and industrial printing. Canon India is looking to tap the country’s emerging...

Learn From Leaders

Does India’s Chip Packaging Growth Need Local Materials At Scale?

0
What will it take for specialised semiconductor materials manufacturing to grow in India? Packaging volumes will be a key factor as OSAT facilities move...
Ronak Kumar Samantray, Founder, TM2Space Technologies Pvt Ltd.

“Our goal is to build data centres in space.” – Ronak Kumar Samantray, TM2Space

0
A space startup aims to build orbital data centres, letting users run AI models and store data on satellites while also supplying satellite hardware...

India’s Photonics Puzzle Is Finally Coming Together 

0
Can India turn its scattered photonics capabilities into a stronger industry? A new association aims to connect the ecosystem and strengthen the domestic value...
Jin Bains, CEO, Mini-Circuits

Mini-Circuits CEO Jin Bains on Navigating High-Frequency Component SWaP-C Constraints, Emerging Markets, and Career...

0
In this exclusive, Jin Bains, Chief Executive Officer (CEO) of Mini-Circuits, explains in a conversation with Dilin Anand of EFY about areas of emerging...

India Needs Not a Hundred, But Thousands of Chip Diversified Companies 

0
Can India build a semiconductor ecosystem beyond fabs? Indiesemic believes thousands of diversified chip companies are needed to make that possible. India’s semiconductor push is...

Startups

Jash Jetly, Co-founder and CEO of EVE

“The cloud isn’t the only way to run AI. We’re proving it can happen...

0
A startup is building a decentralised AI and communication network that runs across everyday devices instead of centralised cloud servers. In an interview, Jash...
Mohit Gupta, founder and CEO, TYLsemi

Building AI Chips, One Block at a Time 

0
What if building an AI chip became as simple as assembling reusable blocks? The startup is working to make custom silicon accessible beyond the...
Seema Johar, Co-Founder and Product Director, Compcarta Solutions Pvt Ltd

“We Let Designers Focus on Innovation, Not Infrastructure.”- Seema Johar, Compcarta Solutions

0
In an exclusive interview, Seema Johar of Compcarta speaks with EFY’s Akanksha Sondhi Gaur about why setting up an EDA environment can be harder...

Space Solar Secures $1.7m ARIA Contract for Wireless Power Beaming

0
Harwell-based firm to develop ground-to-air RF beaming technology for persistent high-altitude platforms. Harwell-based wireless power specialist Space Solar has secured a $1.7 million (£1.3 million)...
Mohit Gupta, Founder and CEO, TYLsemi

“We are democratising custom silicon with reusable chiplets, enabling more companies to build their...

0
In an exclusive interview,Mohit Gupta from TYLsemi explains to Saba Aafreen from Electronics For You as to why the future of AI infrastructure will...