The new facility expands the company’s OSAT capabilities, with a focus on SIM modules, eSIMs and specialised semiconductor packaging.
RRP Electronics Ltd has inaugurated an Advanced Wafer-Level Packaging (AWLP) facility at its semiconductor manufacturing unit in Navi Mumbai, Maharashtra. The expansion strengthens the company’s capabilities in advanced packaging, connectivity modules and specialised semiconductor applications.
The facility was inaugurated by Uday Samant, Maharashtra’s Cabinet Minister for Industries and Marathi Language; Dr Anil Kakodkar; Dr G. Satheesh Reddy; and Rajendra Chodankar, Chairman of RRP Electronics.
The new facility expands the company’s existing Outsourced Semiconductor Assembly and Test (OSAT) capabilities and supports its vision of developing an integrated semiconductor manufacturing ecosystem in India, spanning wafer processing, conventional and advanced packaging, testing, and module manufacturing.
RRP Electronics has established conventional semiconductor packaging capabilities, including Quad Flat No-lead (QFN) packaging, with solutions deployed for customers and organisations. The addition of AWLP expands its portfolio to address increasingly complex semiconductor and electronics applications.
Advanced wafer-level packaging enables integrated circuits to be packaged and interconnected while they remain on the semiconductor wafer, before being separated into individual chips. The process involves forming protective layers and electrical interconnections across the wafer, supporting the development of compact and highly integrated semiconductor devices. As further transistor miniaturisation becomes more challenging and expensive, advanced packaging is gaining importance in improving device integration and performance.
A key application area for the new facility will be SIM and embedded connectivity module manufacturing. RRP Electronics plans to offer manufacturing capabilities for wire-bonded SIM modules, flip-chip-bonded SIM modules, eSIMs, embedded connectivity modules, and specialised semiconductor modules and packages. These capabilities are intended to support customers requiring compact, secure and highly integrated connectivity solutions.
By integrating AWLP with its existing OSAT infrastructure, RRP Electronics aims to provide customers with a broader manufacturing ecosystem covering semiconductor assembly, packaging, testing and module-level solutions. The expansion is also expected to create additional revenue opportunities as the company broadens its manufacturing portfolio and addresses demand for advanced semiconductor packaging and connectivity technologies.
