Hyundai Mobis has launched 13 domestic automotive semiconductor development projects, with nine linked to selected Hyundai and Kia models, as South Korea seeks to reduce import dependence and strengthen local chip supply chains.
Hyundai Mobis is targeting 2029 to integrate domestically developed semiconductors into Hyundai Motor and Kia vehicles, with 13 development projects underway and nine linked to selected vehicle models. The initiative aims to address South Korea’s reliance on imports, which account for 95% of the automotive semiconductors purchased by the two automakers.
The dependence disrupted vehicle production during the global semiconductor shortage in 2021. Through its Automotive Semiconductor Localization Platform (ASK), Hyundai Mobis is connecting domestic semiconductor companies with automakers’ procurement needs. President Lee Gyu-suk said, “Starting next year, controllers equipped with these semiconductors will be tested in the early stages of vehicle development.”
The programme adapts existing electronics technologies for automotive applications. Above Semicon is developing vehicle communication and control chips using technology applied in washing machines, while Global Technology is adapting TV display-driver technology. Neurotac and LX Semicon are working on wireless communication chips for battery management systems.
Hyundai Mobis and Samsung Electronics are also co-developing network semiconductors for in-vehicle data communication, with prototype evaluations underway.
The company is developing system-on-chip (SoC) semiconductors for Hyundai Motor’s next-generation vehicle architecture, targeting completion by 2030. “We are developing SoCs optimized for Hyundai Motor’s next-generation vehicle architecture, targeting completion by 2030 through collaborations with specialized companies,” said Park Chul-hong, Executive Vice President, Semiconductor Business Division, Hyundai Mobis.
Separately, Hyundai Mobis has signed an MoU with SK Keyfoundry, four fabless companies and four supporting institutions to strengthen power semiconductor research and production. It has also proposed a public-private automotive semiconductor fabrication facility to address potential stagnation in 8-inch wafer capacity. A government-backed automotive semiconductor support centre in Cheonan is targeted for completion in June 2027.
