India looks at ASML and Nexperia for deeper partnerships. They want to make semiconductor technology collaboration better and keep supply chains safe.
Commerce and Industry Minister Piyush Goyal met Wayne Allan, Executive Vice President and Member of the Board of Management of ASML. The stated objective was to strengthen India’s position in the global chip value chain. No specific investment, equipment order, technology -transfer agreement, or project was announced.
Goyal also met Stefan Tilgner, Interim CEO of Nexperia. They talked about working together more closely on chips. India’s growing electronics work and tech network were seen as chances for stronger collaborations; still, exact outcomes remain limited.
Ingka Group and Power2X were also part of these discussions.
With the Ingka group, talks covered India’s rising market and factory strength. The plan included using local plants to help Ikea source goods worldwide. They also talked about bigger investments down the road. Juvencio Maextu met the group as the CEO and President of Ingka Group.
Goyal met Occo Roelofsen. He leads Power2X as the founder and CEO. Talks touched on clean energy, green hydrogen, and new tech between India and the Netherlands.
These meetings are part of bigger plans to pull in manufacturing money and build up India’s chip network.
With a strong policy push in India, growing investments, and an expanding talent pool, we explored avenues for collaborations in cutting-edge semiconductor technologies, innovation, and skilling to strengthen India’s position in the global chip value chain.- Piyush Goyal, Union Minister of Commerce and Industry, Government of India.
