The new HBM plant by Samsung Electronics will have three floors of cleanroom space covering over 31,000 square kilometres.
South Korean President , Lee Jae Myung, during a groundbreaking ceremony for Samsung’s investment plans announced in July, said that the chipmaker’s 6 trillion won ($4.81 billion) in a high-bandwidth memory (HBM) plant in Asan, South Korea will be followed by 40 trillion won ($30 billion) investment in advance equipment.
Samsung Electronics announced during the presentation that the new HBM production line is scheduled to be operationalised by June 2028 as it attempts to tap growing demand for server memory and take some share from fellow South Korean market leader SK hynix.
The new HBM plant will have three floors of cleanroom space covering over 31,000 square kilometres. The government of South Korea is looking forward to companies like Samsung and SK hynix to drive “mega projects” covering semiconductors, physical artificial intelligence and AI data centres.
