Electronics industry professionals have a new venue for collaboration on IPC standards, with opportunities to participate in standards development meetings during IPC Electronic System Technologies Conference (IPC ESTC) in Las Vegas May 21–22.
“IPC ESTC presents an opportunity to discuss key IPC standards in person, and welcome new colleagues to the conversation,” says Jack Crawford, IPC director of certification and staff liaison to the industry for several IPC standards. “While we can accomplish a lot through online collaboration and teleconferences, nothing compares to the energy and information exchange you get through face-to-face discourse.”
On Tuesday, May 21, IPC’s Requirements for Structural Enclosure Task Group, chaired by Eddie Hofer of Rockwell Collins and Richard Rumas, CIT, of Honeywell Canada, will evaluate submissions for a new standard, IPC-A-630, Acceptability Standard for the Design, Manufacture, Inspection and Testing of Electronic Enclosures.
On Wednesday, May 22, IPC’s Wire Harness Acceptability Task Group, led by chairs Theodore Laser, MIT, L-3 Communications and Brett Miller, USA Harness, Inc., will work on an amendment to the widely used joint standard, IPC/WHMA-A-620B, Requirements and Acceptance for Cable and Wire Harness Assemblies.
In addition to the two standards meetings, a strategy meeting for a new organization, the Coalition for the Advancement of MicroElectronic Systems Technology (CAMEST), will take place at IPC ESTC on Tuesday, May 21. CAMEST is an independent organization dedicated to fostering collaboration among the global electronics industry, academia and government.
For more information on IPC ESTC and its standards development activities, or to register, visit www.ipc.org/estc. For more information on all IPC standards development activities, visit www.ipc.org/standards.
