January, Monday 20, 2014: Flexibility, performance and accuracy – SIPLACE placement machines occupy the top spots in all three of these critical disciplines. For example, the improved version of the SIPLACE X4i S sets a new record with a rating of 150,000 cph (components per hour). And unique interchangeable gantries, new options and software modules for accelerated NPI processes and innovative setup changeover concepts further solidify the special position of the SIPLACE platform in terms of flexibility and scalability. The SIPLACE CA combines flip chip, die attach and SMT processes in a single machine and operates with an accuracy of 10μm at 3 sigma (MAC test).
“We are actually able to demonstrate the respectively fastest, most accurate and most flexible placement solutions. This further underlines our position as the industry’s technology leader. Boosted by working together with the developers at ASMPT, our SIPLACE development teams have made many improvements in the latest generations of our SIPLACE platforms,” says Gabriela Reckewerth, Global Marketing Director at ASM Assembly Systems. “As a result, we offer the youngest and most modern portfolio of placement solutions. This gives us top benchmark ratings and provides our customers with significant competitive advantages. And with our SIPLACE software suite we flexibly integrate the performance of our placement machines into customer-specific processes and create consistent workflows for all users on the production floor. This optimizes our customers’ productivity and gives them a sustainable competitive advantage.”
The fastest…
Equipped with the fast 20-nozzle SIPLACE SpeedStar head, the SIPLACE X4i S is setting new records with speeds of up to 150,000 cph. The new SIPLACE flagship positions the SIPLACE X-Series as the platform of choice for demanding high-volume applications. But since flexibility plays an increasingly important role in this segment as well, the SIPLACE X-Series offers not only options like the SIPLACE Glue Feeder, Linear Dip Unit and support for PoP placement applications. The new version also features SIPLACE’s interchangeable gantries, giving manufacturers new options in responding flexibly to changing demand levels.
The most flexible…
For the flexible on-demand production of small and medium lot sizes, the highly flexible SIPLACE SX is the solution of choice, because its gantries, including placement heads can be easily added or removed by the user. This makes it possible to flexibly transfer placement performance capability between lines or temporarily rent gantries when short-term demand peaks make this feasible. These features are complemented by the SIPLACE MultiStar placement head, which can switch between three modes (Collect & Place, Pick & Place and Mixed Mode) in response to software commands and is able to handle an extremely broad spectrum of component sizes and types. SIPLACE hardware and software options also make it easy to establish consistent NPI processes, letting you push new products out the door much more quickly and reliably than before.
The most accurate…
Directly from the wafer or from the tape – the SIPLACE CA (which stands for “chip assembly”) combines flip chip, die attach and SMT processes on a single platform. It allows electronics producers to respond to the rising demand for bare die processing and use the high performance of the SIPLACE CA for regular SMT production when these special capabilities are not needed. With an accuracy rating of 10 μm at 3 sigma, the SIPLACE CA leaves nothing to be desired in terms of quality.
For more information, visit www.siplace.com.
ASM Assembly Systems
The SIPLACE team is a unit of ASM Pacific Technology operating under the ASM Assembly Systems name. With its SIPLACE machines and innovative manufacturing concepts, ASM Assembly Systems GmbH & Co. KG is the world’s leading manufacturer of surface mount technology (SMT) placement machines and solutions. Since its beginnings in 1985, the company has installed almost 35,000 SIPLACE placement machines at more than 3,500 customers worldwide. Electronics manufacturers in all industries such as telecommunications, automotive, IT, consumer
For more information about ASM Assembly Systems (SIPLACE), visit www.siplace.com.
ASM Pacific Technology Limited
ASM Pacific Technology (ASMPT) has been listed on the Hong Kong Stock Exchange since 1989. The ASMPT Group develops systems and solutions for semiconductor production and packaging as well as surface mount technology applications. The company has plants in Hong Kong, China, Singapore, Malaysia and Germany.
ASMPT is currently one of the constituent stocks on the Hang Seng HK MidCap Index under the Hang Seng Composite Index, the Hang Seng Information Technology Industry Index, the Hang Seng Hong Kong 35 index and the Hang Seng Global Composite Index.
For more information about ASMPT, visit www.asmpacific.com
Please direct any reader inquiries to: ASM Assembly Systems Singapore Pte Ltd
Irene Lim
Email: irene.lim@asmpt.com
