Samsung Electronics unveiled 5G chipsets to boost its next generation 5G RAN portfolio in the virtual event ‘Samsung Networks: Redefined’ on Tuesday. The new chipsets include third generation RFIC, a second generation 5G modem SoC and a DFE-RFIC integrated chip.
The latest chips are said to power Samsung’s new products including 5G Compact Macro, Massive MIMO radios, that is expected to arrive the commercial markets in 2022. The third generation RFIC designed to support both 28GHz and 39GHz spectrums, will incorporate advance technology that will reduce Compact Macro’s antenna size by nearly 50 per cent, thus expanding the radio’s interior space. Samsung said the new second generation modem SoC will be embedded in its upcoming baseband unit. The DFE-RFIC integrated chip will double frequency bandwidth and also reduce the size and increase output power for the company’s next generation solutions.
Unveiling the in-house chipsets, the company aims to reduce the size and foster high performing, efficient 5G solutions. “This newly unveiled chipset is the fundamental component of our state-of-art 5G solutions, developed through a long-standing R&D effort that enables Samsung to be at the forefront of delivering cutting-edge 5G technologies,” said Junehee Lee, Executive Vice President and Head of R&D, Networks Business at Samsung Electronics. He added that Samsung is committed to developing innovative chips integrated with features expected by mobile operators.
Samsung highlighted its key developments in global expansion, its ability to provide secure private networks and its vision on 6G at the virtual event.
