Asetek company’s Direct-to-Chip liquid cooling technology is being used to cool the fastest supercomputers in Taiwan and Japan
Danish liquid-cooling company Asetek announced that its Direct-to-Chip (D2C) liquid cooling technology is cooling thirteen installations on the November 2018 edition of the TOP500 list of the fastest supercomputers in the world.
This is yet another achievement for Asetek as it moves from eleven to thirteen installations in the latest edition of the TOP500 list. Out of the 13 installations, three systems are listed in the TOP20.
Asetek specializes in liquid cooling solutions for computers, servers, and data centers. It offers flexible, reliable and proven liquid cooling for high performance computing (HPC) and artificial intelligence (AI).
Three installations in TOP20 list
Three of the installations in the TOP20 include the fastest supercomputers in Taiwan and Japan.
Ranked #7 on the TOP500 list is the fastest supercomputer in Japan, the AI Bridging Cloud Infrastructure system (ABCI) installed at the National Institute of Advanced Industrial Science and Technology. This was installed by Asetek’s OEM partner Fujitsu.
Ranked #14 on the TOP500 list is the Oakforest-PACS system installed at the Joint Center for Advanced High Performance Computing. This was also installed by Asetek’s OEM partner Fujitsu.
Holding the 20th spot on the list is Taiwania 2 installed at the National Center for High-Performance Computing by Asetek’s OEM partner QCT.
Other systems in Asia include the ITO subsystem at Kyushu University (#37), the Grand Chariot system at Hokkaido University (#95), Afinity at Tohoku University (#126), Big Waterfall at RIKEN (#193), Taiwania at NCHC (#237), and the NSCC cluster at the National Supercomputing Centre Singapore (#420). All of these are installed by Asetek’s OEM partner Fujitsu.
Clusters in North America on the list include Los Alamos National Laboratory (LANL) Grizzly (#204), Sandia National Laboratories (SNL) Cayenne (#275), Serrano (#276) and Eclipse (#308). These clusters were installed by Asetek’s OEM partner Penguin Computing under the National Nuclear Security Administration Commodity Technology Systems-1 (CTS-1) contract.
John Hamill, Chief Operating Officer at Asetek, said, “HPC and AI workloads require high performance processors in dense configurations. The TOP500 list is proof positive that Asetek liquid cooling is being recognized as an optimal solution to cool the dramatically higher power densities of the racks deployed for these applications.”
Asetek-Intel collaboration
Asetek and Intel have recently collaborated to solve the heat management challenges associated with HPC and AI workloads. They are working together to bring warm water liquid cooling to the latest Intel Compute Modules featuring Intel Xeon Scalable Processors and Intel Xeon Phi Processors with both Asetek’s D2C and Liquid Assisted Air Cooling technologies.
“We look forward to seeing HPC and AI clusters based on liquid-cooled Intel Compute Modules make future TOP500 lists. We are extremely proud to be the only liquid cooling solution validated and factory installed by Intel,” said Hamill.
The TOP500 List
The TOP500 list is compiled by Erich Strohmaier and Horst Simon of Lawrence Berkeley National Laboratory; Jack Dongarra of the University of Tennessee, Knoxville; and Martin Meuer of ISC Group, Germany.
