- Eyeing a USD 10-billion incentive, HCL gears up for a game-changing ATMP semiconductor unit.
- HCL isn’t just looking to make an entry; they’re aiming for the skies.
In a bold pivot towards fortifying India’s electronics landscape, HCL Group is meticulously charting its entry into the nation’s semiconductor ecosystem. With an estimated budget between USD 200-300 million, the global tech giant is gearing up to present its business proposal for establishing an assembly, testing, marking, and packaging (ATMP) semiconductors unit to the Central government.
HCL’s financial commitment isn’t just substantial; it’s a clarion call. A $300 million injection into the semiconductor segment illustrates the group’s unwavering faith in the sector’s potential.
To successfully maneuver within the realm of chip packaging, HCL recognizes the necessity of partnerships. “Harnessing the potential of collaborative synergy, especially in specialized domains like chip packaging, is crucial,” suggests a source familiar with the matter.
ATMP/OSAT facilities aren’t just another link in the semiconductor production chain; they’re pivotal. They shoulder the responsibility of testing and packaging the indispensable silicon chips.
India’s commitment to fostering a robust semiconductor landscape is evident. Under existing schemes, businesses like HCL, plunging into chip production, can avail subsidies spanning up to a staggering 75% of their capital outlay.
While the news might seem like a fresh avenue for HCL, the conglomerate is no stranger to semiconductors. Apart from their renowned software prowess, they’ve left imprints in the semiconductor sector, extending expertise from lithography and etching to packaging and testing for global entities.
