Union Telecom and IT Minister Ashwini Vaishnaw anticipates establishing the country’s inaugural electronic chip manufacturing facility within the year. The government has allocated an initial USD 10 billion for creating a semiconductor manufacturing ecosystem, including a wafer fabrication plant essential for high-tech electronics.
Vaishnaw emphasized global leadership aspirations in niche areas, particularly telecom and electric vehicles (EVs). He feels that focusing on chips for these sectors can position us as global frontrunners. The minister expressed optimism about imminent success in wafer fabrication, design, and manufacturing.
Highlighting the confidence boost from US-based Micron’s investment in India, Vaishnaw noted the company’s recent initiation of a semiconductor assembly plant in Gujarat. This USD 2.75 billion project, partly funded by Micron, the Centre, and the state government, has spurred Micron’s component suppliers to scout for land in collaboration with local authorities.
Under the Digital India RISC-V initiative, the government aims to launch the first domestic chipsets by 2023-24. IIT Madras and CDAC have already crafted two microprocessors, Shakti and Vega, under the Ministry of Electronics and IT’s Microprocessor Development Programme.
In conclusion, Vaishnaw shared the government’s vision of India becoming a global hub for 4-5 key components, catering to domestic and international markets.
