The agreement aims to accelerate next-generation patterning, including dry resist technology for EUV lithography, and advance new materials.
JSR Corporation and Lam Research have signed a cross-licensing and collaboration agreement in advancing semiconductor manufacturing. The collaboration focuses on next-generation patterning technologies, printing chips in Silicon Wafers, including dry resist for extreme ultraviolet (EUV) lithography.
The deal links JSR’s innovative semiconductor materials, including metal oxide solutions with Lam’s expertise in deposition, etching and dry resist processing, which includes its latest technology including Aether. Aims to reduce the cost and complexity of creating the intricate patterns required for chips for artificial intelligence (AI) and high-performance computing (HPC).
“By richly complementing Lam’s proven atomic layer deposition and etch capabilities, which includes driving new low-NA and high-NA EUV patterning materials and metal oxide resists and providing greater access to Aether dry resist technology.” said Vahid Vahedi, chief technology and sustainability officer, Lam Research.
The collaboration also covers atomic layer etching and deposition, technologies required for nanoscale control. Joint research will target new precursor materials and advanced films. JSR’s acquisition of Yamanaka Hutech provides additional resources in this area.
Patterning remains a bottleneck for advanced nodes. Dry resist is being developed as a method to simplify EUV processes and reduce cost. By combining materials and equipment, the partners plan to address production challenges at both low-NA and high-NA EUV lithography.
Toru Kimura, senior officer, JSR Corporation said “By combining JSR materials expertise, we aim to accelerate solutions for EUV lithography – including high NA – and support the industry to scale efficiently for the new AI era.”
The agreement follows structural shifts in the semiconductor supply chain. With more complex architectures and tighter margins, chipmakers are seeking integrated solutions between equipment vendors and material suppliers. Partnerships of this type are becoming a way to speed technology roadmaps while reducing development risks.
